Introduction To Surface-Micromachining,9781402080203

Introduction To Surface-Micromachining

by ;
ISBN13: 9781402080203
ISBN10: 1402080204
Format: Hardcover
Pub. Date: 2004-05-30
Publisher(s): Kluwer Academic Pub
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Summary

An Introduction to Surface-Micromachining provides for the first time a unified view of surface-micromachining. Building up from the basic building block of microfabrication techniques, to the general surface-micromachining design, it will finish with the theory and design of concrete components. An Introduction to Surface-Micromachining connects the manufacturing process, microscale phenomena, and design data to physical form and function. This book will be of interest to mechanical engineers looking to scale down into micromachining and microelectronics designers looking to move horizontally to micromachining.

Table of Contents

Dedication v
Preface xi
Acknowledgments xiii
1. INTRODUCTION 1(8)
1.1 Why miniaturize?
2(1)
1.2 Why surface-micromachining?
3(1)
1.3 History
4(1)
References
5(4)
Part I Fabrication
2. MICROFABRICATION PROCESSES
9(20)
2.1 Photolithography
9(5)
2.2 Thermal Growth
14(1)
2.3 Deposition
15(3)
2.4 Etching
18(3)
2.5 Doping
21(1)
2.6 Chemical Mechanical Polishing (CMP)
22(1)
2.7 Wafer Bonding
23(1)
2.8 Release
24(1)
2.9 Wire Bonding
25(3)
References
28(1)
3. MICROMACHINING TECHNOLOGIES
29(16)
3.1 Bulk Micromachining
31(3)
3.2 LIGA
34(1)
3.3 Surface-Micromachining
35(6)
References
41(4)
Part II Design
4. MICROSCALE PHYSICS
45(18)
4.1 Scaling Laws
45(6)
4.2 Casimir Force
51(1)
4.3 Surface Forces
52(3)
4.4 Friction
55(2)
4.5 Continuum Mechanics Approximation
57(4)
References
61(2)
5. MECHANICS
63(12)
5.1 Beam Equations
63(3)
5.2 Torsion
66(2)
5.3 Cantilevers
68(2)
5.4 Euler-columns
70(1)
5.5 Pseudo-rigid body Modelling
71(2)
References
73(2)
6. DESIGN RULES
75(6)
6.1 Minimum Geometry Rules
75(1)
6.2 Maximum Geometry Rules
76(1)
6.3 Minimum Enclosure Rules
77(1)
6.4 Minimum Overlap Rules
78(1)
6.5 Design Rule Checks (DRC)
78(3)
7. NON-IDEAL PROCESSES
81(12)
7.1 Topography
81(4)
7.2 Dimensional Tolerances
85(2)
7.3 Thin-film Stresses
87(5)
References
92(1)
8. DESIGN TECHNIQUES
93(10)
8.1 Ground Planes
93(1)
8.2 Double Thickness Parts
94(1)
8.3 Conducting Paths
95(1)
8.4 Tethers
96(1)
8.5 Dimples
97(1)
8.6 Process Variations
98(1)
References
99(4)
Part III Devices
9. ELECTRICAL COMPONENTS
103(12)
9.1 Bonding Pads
103(3)
9.2 Resistors
106(2)
9.3 Capacitors
108(2)
9.4 Inductors
110(2)
References
112(3)
10. MECHANICAL COMPONENTS
115(20)
10.1 Compliant Devices
115(1)
10.2 Springs
116(3)
10.3 Suspensions
119(5)
10.4 Flexure Joints
124(2)
10.5 Levers
126(7)
References
133(2)
11. ELECTROSTATIC ACTUATORS
135(18)
11.1 Parallel-Plate Actuators
136(5)
11.2 Interdigitated Comb Actuators
141(4)
11.3 Curved Electrode Actuators
145(2)
11.4 Scratch-drive Actuators
147(3)
References
150(3)
12. ELECTRO-THERMAL-COMPLIANT ACTUATORS
153(12)
12.1 Thermal Bimorph Actuators
154(1)
12.2 Guckel Actuators
154(5)
12.3 Bent-beam Actuators
159(3)
12.4 Topological Optimization
162(2)
References
164(1)
13. RAISED STRUCTURES
165(12)
13.1 Hinges
165(3)
13.2 Assembly
168(4)
References
172(5)
Part IV Processes
14. POLYMUMPSTM PROCESS
177(4)
14.1 Design Rules
178(1)
14.2 Photo Gallery
178(1)
References
179(2)
15. SUMMITTM PROCESS
181(2)
15.1 Design Rules
182(1)
15.2 Photo Gallery
182(1)
16. MUSIC® PROCESS
183(6)
16.1 Design Rules
184(1)
16.2 Photo Gallery
184(1)
References
184(5)
Index 189

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