| Dedication |
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| Preface |
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xxix | |
| Acknowledgments |
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xxxi | |
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1 | (18) |
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2 | (2) |
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4 | (1) |
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Typical manufacturing process |
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4 | (1) |
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5 | (1) |
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6 | (5) |
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High frequency characteristics |
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6 | (3) |
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Thermal stability (low thermal expansion, good thermal resistance) |
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9 | (1) |
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Integration of passive components |
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10 | (1) |
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Trends in materials developed by relevant companies |
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11 | (1) |
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12 | (7) |
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16 | (3) |
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Part 1 Material technology |
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19 | (82) |
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21 | (38) |
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21 | (2) |
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23 | (13) |
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24 | (2) |
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26 | (7) |
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33 | (3) |
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Reaction between glass and ceramic |
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36 | (1) |
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Dielectric characteristics |
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36 | (6) |
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36 | (5) |
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41 | (1) |
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42 | (3) |
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45 | (9) |
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Strengthening the glass phase |
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47 | (4) |
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51 | (3) |
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54 | (5) |
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55 | (4) |
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59 | (24) |
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59 | (2) |
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Conductive paste materials |
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61 | (1) |
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Metallization methods for alumina ceramics |
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62 | (4) |
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62 | (1) |
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High temperature process type (Mo-Mn method) |
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62 | (1) |
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Low temperature process type |
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63 | (1) |
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64 | (2) |
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66 | (1) |
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66 | (2) |
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Suitability for co-sintering |
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68 | (4) |
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72 | (2) |
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74 | (4) |
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Bondability (solder wetability and wire bondability) |
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78 | (5) |
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79 | (4) |
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Resistor materials and high K dielectric materials |
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83 | (18) |
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83 | (1) |
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84 | (8) |
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Ruthenium oxide/glass material |
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87 | (2) |
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The thermal stability of ruthenium oxide |
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89 | (3) |
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High K dielectric material |
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92 | (9) |
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Issues with low oxygen partial pressure atmosphere firing (point defects and semiconductor formation) |
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93 | (5) |
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98 | (3) |
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Part 2 Process technology |
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101 | (116) |
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Powder preparation and mixing |
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103 | (12) |
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103 | (1) |
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Inorganic ceramic materials |
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104 | (1) |
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105 | (10) |
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106 | (2) |
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108 | (2) |
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Dispersing agent and dispersibility of slurry |
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110 | (4) |
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114 | (1) |
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115 | (30) |
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115 | (1) |
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115 | (2) |
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117 | (3) |
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120 | (22) |
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Characteristics required of green sheets |
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120 | (1) |
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Green sheet evaluation methods |
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121 | (5) |
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Various factors affecting the characteristics of green sheets |
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126 | (10) |
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Green sheet microstructure |
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136 | (4) |
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Green sheet dimensional stability |
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140 | (2) |
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142 | (3) |
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143 | (2) |
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145 | (22) |
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145 | (7) |
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Screen printing screen specifications |
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147 | (1) |
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Printing process conditions |
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147 | (2) |
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149 | (3) |
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Green sheet characteristics |
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152 | (1) |
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152 | (2) |
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154 | (13) |
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Laminating process technologies |
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154 | (3) |
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Faults arising in the laminating process |
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157 | (5) |
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162 | (3) |
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165 | (2) |
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167 | (26) |
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169 | (1) |
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Controlling firing shrinkage |
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169 | (5) |
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Mismatches of firing behavior and firing shrinkage rate |
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174 | (6) |
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Achieving both antioxidation of the copper and elimination of binder |
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180 | (9) |
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189 | (1) |
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Cofiring process and future LTCCs |
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190 | (3) |
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191 | (2) |
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193 | (10) |
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195 | (1) |
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Thermal expansion and residual stress of LTCCs |
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196 | (4) |
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Thermal conductivity of LTCCs |
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200 | (3) |
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201 | (2) |
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203 | (14) |
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204 | (1) |
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Technology development of LTCCs for the future |
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204 | (6) |
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Materials technology development |
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208 | (2) |
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210 | (1) |
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Background of post-LTCC technology |
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210 | (7) |
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AD process as a post-LTCC technology |
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Current and future state of development of AD ceramic film |
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217 | (1) |
| Acknowledgement |
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217 | (2) |
| References |
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| Index |
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219 | |
Other versions by this Author
