Power Electronic Modules: Design and Manufacture
by Sheng, William W.; Colino, Ronald P.Pub. Date: 2004-09-29
Publisher(s): Taylor & Francis
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Summary
Because of their growing importance in the power industry, power modules are attracting a lot of interest. Power Electronic Modules: Design and Manufacture includes a vast amount of useful information about the development of this product. It is organized into three sections: materials, manufacturing processes and quality control, and design and results. Most power semiconductor manufacturers are either already producing or are in the process of developing power modules. The text compares different designs by building and testing actual samples. The authors explain the latest developments in the field while setting the basic foundation for power module design and manufacturing.
Table of Contents
| Introduction | |
| Selection Procedure | |
| Materials | |
| Insulating Substrate and Metallization | |
| Base Plate | |
| Bonding Material | |
| Power Interconnection and Terminal | |
| Encapsulant | |
| Plastic Case and Cover | |
| Manufacturing of Power IGBT Modules | |
| Manufacturing Process | |
| Process Control/Long-Term Reliability | |
| Manufacturing Facilities | |
| Manufacturing Flow Charts | |
| Design | |
| Thermal Management | |
| Circuit Partitioning | |
| Design Guidelines and Considerations | |
| Thermal Results of Different Samples | |
| Table of Contents provided by Publisher. All Rights Reserved. |
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